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Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP

ISSN: 2836-8487eISSN: 2768-1874
Active
Publisher
Institute of Electrical and Electronics Engineers Inc.
Subject Areas
Control and OptimizationElectrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsInstrumentationSafety, Risk, Reliability and Quality

Indexing & Recognition

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Scopus
Source: Scopus Source List
ListedH-Index 1 · Coverage 2025
Last verified: 4 Jun 2026
Web of Science
ABDC
Not listed
DOAJ
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Record last updated: 4 June 2026

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