Active
Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP
ISSN 2836-8487 · eISSN 2768-1874Institute of Electrical and Electronics Engineers Inc.
Subject Areas
Control and OptimizationElectrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsInstrumentationSafety, Risk, Reliability and Quality
Indexing & Recognition
Data sourced from official lists. Always cross-verify with the primary indexing database.
Scopus
Source: Scopus Source List
ListedH-Index 1 · Coverage 2025
Last verified: 4 Jun 2026
Web of Science
No dataVerify at Clarivate MJL
ABDC
Not listed
DOAJ
Not listed
Verification Sources
This record was compiled from the following sources. Data may not reflect real-time changes — always verify with the primary source.
Scopus Source ListVisit →
Data is provided for informational purposes only and may be outdated — always verify with the primary source before submitting. Academint is not affiliated with these providers. Sources & attribution →
Record last updated: 4 June 2026
Comments
Share your experience with Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP — review timelines, peer-review quality, fees, or anything useful to other researchers. Comments are public.
Loading comments…